MediaTek announced Helio P22 chipset today. This chipset has been designed for new premium smartphones falling under mid-range pricing.
This MediaTek Helio P22 chipset will be on TSMC’s 12nm FinFET manufacturing process which is said to deliver better power efficiency as compared to previous mid-range chipsets from MediaTek. Besides, Helio P22 will also support Light AI-enhancements like Face Unlock, dual-camera support, Helio X30 grade twin ISP and better connectivity features.
Helio P22 will also be capable of minimizing grain, noise, aliasing, chromatic aberration and more because of hardware depth engine for real-time Bokeh preview. Interestingly, Helio P22 will also support an aspect ratio of 20:9 i.e. HD+ (1600 x 720 pixel) display.
According to the company, the mass production of Helio P22 has already commenced and you will see it in smartphones by the end of second quarter.
TL Lee, General Manager, MediaTek Wireless Communication business unit said earlier this year,”Our latest generation of Helio chips, such as Helio P60, have generated significant interest and exceeded our expectations. The continued customer demand we’re witnessing validates our focus on the growing mid-market segment and its clear consumers have an appetite for innovative devices that offer outstanding features at an affordable price point. With the support of high-quality dual camera photography, AI enhancements and incredible power efficiency, the Helio P22 sets a new bar for accessibility to premium features. We expect continued device maker wins and consumer growth in this segment with MediaTek’s new Helio P22 chipset.”